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Strain Testing & Analysis

Strain gages are used to determine material stress due to static and dynamic loads coming from internal and external sources such as mechanical, thermal and pressure.

  • In-house and field strain gage applications and testing
  • Load monitoring
  • Thermal stress analysis
  • Mechanical stress analysis
  • Residual stress analysis
  • CTE testing

HITEC Corporation can bond or weld any type of strain gage to the test surface, perform data acquisition and provide test data to assist in identifying the stress, mechanical failure or fatigue to verify your design, uncover weak points, and/or validate your FEA. In all cases, HITEC Corporation has the experience to assist in increasing your component reliability.

NEW! Our response to PC Board testing: click here for specifics on how HITEC Corporation can assist in preventing PC Board component failures using strain gage technology.

Click here to submit your application inquiry

 

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