...for solder joint reliability and preventing component
failures during assembly, handling and testing operations.

Contact HITEC today to confidently outsource
your PC board strain gaging and testing needs

Expertise in strain gage placement, calibration and data acquisition to provide accurate strain measurements for pc board component failure prevention; conforming to IPC/JEDEC-9704.

Dynamic strain measurements recorded for various manufacturing sequence processes, for identifying strain and correlating to specific sequence steps.

Moving toward lead free production – lead free solder alloys have increased stiffness preventing appropriate stress distribution and are more sensitive to strain rate with greater potential for brittle fracture failures.

Monotonic Bend Characterization per IPC/JEDEC-9702 for testing surface mount components attached to printed wiring boards using our strain gage expertise and using our Instron® Test machine. 

Proactive strain gage testing resulting in significant cost savings by uncovering, separating and correcting elevated strain levels related to the board singulation and assembly processes.

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